ICCAS OpenIR
A novel tube-structure entrapped curing accelerator for prolonging the shelf-life of epoxy resin-based microelectronic packaging material
Zhang, Y; Cao, M; Guo, GQ; Sun, J; Li, Z; Xie, P; Zhang, RB; Fu, PF
2002-08-01
Source PublicationJOURNAL OF MATERIALS CHEMISTRY
ISSN0959-9428
Volume12Issue:8Pages:2325-2330
AbstractA new curing system used for prolonging the shelf-life of epoxy resin-based microelectronic packaging material (E-MPM) was first prepared by an in situ tubing/entrapping method. Based on supramolecular interactions a curing accelerator (C) for epoxy resin, boron trifluoride-pyridine (BF3.Py), has been trapped into the pores of polyorganosiloxane (POS) containing a nanoscale tubular structure, which is prepared by hydrosilylation of two reactive, cis-isotactic ladderlike polyallylsilsesquioxane (Allyl-T) molecules with two reactive, alpha,omega-coupling agents (1,1,3,3-tetramethyldisiloxane, H-MM) in two plus two (2 + 2) mode using Cp2PtCl2 as catalyst. Various characterizations including optical polarized microscopy (OPM) observations, differential scanning calorimetry (DSC) measurements, storage and curing tests and molecular mechanical simulation are combined to confirm that the accelerator BF3.Py is Simultaneously trapped during the formation of POS and moreover, to indicate that entrapment of the accelerator C with POS is a promising alternative way to prolong the shelf-life of the E-MPM at ambient temperature.
DOI10.1039/b200475e
Indexed BySCI
Language英语
WOS IDWOS:000177525600030
PublisherROYAL SOC CHEMISTRY
Citation statistics
Cited Times:8[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.iccas.ac.cn/handle/121111/78116
Collection中国科学院化学研究所
Corresponding AuthorZhang, RB
Affiliation1.Chinese Acad Sci, Inst Chem, Ctr Mol Sci, State Key Lab Polymer Phys & Chem, Beijing 100080, Peoples R China
2.Dow Corning Corp, New Ventures R&D, Midland, MI 48686 USA
Recommended Citation
GB/T 7714
Zhang, Y,Cao, M,Guo, GQ,et al. A novel tube-structure entrapped curing accelerator for prolonging the shelf-life of epoxy resin-based microelectronic packaging material[J]. JOURNAL OF MATERIALS CHEMISTRY,2002,12(8):2325-2330.
APA Zhang, Y.,Cao, M.,Guo, GQ.,Sun, J.,Li, Z.,...&Fu, PF.(2002).A novel tube-structure entrapped curing accelerator for prolonging the shelf-life of epoxy resin-based microelectronic packaging material.JOURNAL OF MATERIALS CHEMISTRY,12(8),2325-2330.
MLA Zhang, Y,et al."A novel tube-structure entrapped curing accelerator for prolonging the shelf-life of epoxy resin-based microelectronic packaging material".JOURNAL OF MATERIALS CHEMISTRY 12.8(2002):2325-2330.
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