Polyamide 6 silica nanocomposites prepared by in situ polymerization
Yang, F; Ou, YC; Yu, ZZ
AbstractA polyamide 6 (PA 6)/silica nanocomposite was obtained through a novel method, in situ polymerization, by first suspending silica particles in epsilon-caproamide under stirring and then polymerizing this mixture at high temperature under a nitrogen atmosphere. The silicas were premodified with aminobutyric acid prior to the polymerization. The effects of the addition of unmodified and modified silicas on the dispersion, interfacial adhesion, isothermal crystallization, and mechanical properties of PA 6 nanocomposites were investigated by using scanning electron microscopy, dynamic mechanical analysis, differential scanning calorimetry, and mechanical tests, respectively. The results show that the silicas dispersed homogeneously in the PA 6 matrix. The addition of silicas increases the glass transition temperature and crystallization rate of PA 6. The mechanical properties such as impact strength, tensile strength, and elongation at break of the PA 6/modified silica nanocomposites showed a tendency to increase and decrease with increase of the silica content and have maximum values at 5% silica content, whereas those of the PA 6/unmodified silica system decreased gradually. (C) 1998 John Wiley & Sons, Inc.
KeywordIn Situ Polymerization Nanocomposites Mechanical Properties Polyamide 6 Silica
Indexed BySCI
WOS IDWOS:000073895400017
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Document Type期刊论文
Corresponding AuthorOu, YC
AffiliationChinese Acad Sci, Inst Chem, State Key Lab Engn Plast, Beijing 100080, Peoples R China
Recommended Citation
GB/T 7714
Yang, F,Ou, YC,Yu, ZZ. Polyamide 6 silica nanocomposites prepared by in situ polymerization[J]. JOURNAL OF APPLIED POLYMER SCIENCE,1998,69(2):355-361.
APA Yang, F,Ou, YC,&Yu, ZZ.(1998).Polyamide 6 silica nanocomposites prepared by in situ polymerization.JOURNAL OF APPLIED POLYMER SCIENCE,69(2),355-361.
MLA Yang, F,et al."Polyamide 6 silica nanocomposites prepared by in situ polymerization".JOURNAL OF APPLIED POLYMER SCIENCE 69.2(1998):355-361.
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