ICCAS OpenIR
Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior
Wei, W; Dong, W; Cheng, Y
1998-12-19
Source PublicationJOURNAL OF APPLIED POLYMER SCIENCE
ISSN0021-8995
Volume70Issue:12Pages:2471-2477
AbstractVarious bismaleimide-diamine Michael addition type prepolymers were prepared through melt condensation and using acetone, dimethylformamide, and m-cresol as solvents in a molar ratio of 1 : 1. Structures of the prepolymers, such as terminal moieties and molecular weight of main chain, depended strongly an the preparation conditions used. More terminal double bonds were observed in the molecule of the prepolymer (sample 3) prepared in dimethylformamide solution without a catalyst. In contrast, the prepolymer produced in m-cresol solution had a polyaspartimide structure with a higher molecular weight. The differential scanning calorimetry and Fourier transform infrared spectra results demonstrated that the molecular structure of the prepolymer had a noticeable effect on their thermal-curing behavior. Thermal properties (T-g and T-d) of cured polymers were evaluated. The polyimide (sample 3b) from sample 3 exhibited the highest T-g and T-d1, but still retained very good processing properties for film casting. (C) 1998 John Wiley & Sons, Inc.
KeywordBismaleimide Diamine Prepolymer Fourier Transform Infrared Spectra Differential Scanning Colorimetry Thermal Gravimetric Analysis
Indexed BySCI
Language英语
WOS IDWOS:000076762700020
PublisherJOHN WILEY & SONS INC
Citation statistics
Cited Times:7[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.iccas.ac.cn/handle/121111/74248
Collection中国科学院化学研究所
Corresponding AuthorDong, W
AffiliationChinese Acad Sci, Inst Chem, Beijing 100080, Peoples R China
Recommended Citation
GB/T 7714
Wei, W,Dong, W,Cheng, Y. Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior[J]. JOURNAL OF APPLIED POLYMER SCIENCE,1998,70(12):2471-2477.
APA Wei, W,Dong, W,&Cheng, Y.(1998).Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior.JOURNAL OF APPLIED POLYMER SCIENCE,70(12),2471-2477.
MLA Wei, W,et al."Preparation and characterization of bismaleimide-diamine prepolymers and their thermal-curing behavior".JOURNAL OF APPLIED POLYMER SCIENCE 70.12(1998):2471-2477.
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