ICCAS OpenIR
Micropatterning of polymeric semiconductor by selective lift-off method using epoxy mold
Wang, Zhe1,2; Yu, Xinhong2; Xing, Rubo2; Han, Yanchun2; Takahara, Atsushi1
2009-07-01
Source PublicationJOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN1071-1023
Volume27Issue:4Pages:1958-1962
AbstractA simple and efficient method for patterning polymeric semiconductors for applications in the field of organic electronics is proposed. The entire polymer layer, except for the desired pattern, is selectively lifted off from a flat poly(dimethylsiloxane) (PDMS) stamp surface by an epoxy mold with a relief pattern. This is advantageous because the elastic deformation of the PDMS stamp around protrusions of a patterned stamp under pressure can assist the plastic deformation of a polymer film along the pattern edges, yielding large area and high quality patterns, and the PDMS surface has low surface energy, which allows the easy removal of the polymer film.
KeywordElastic Deformation Organic Semiconductors Plastic Deformation Polymer Films Surface Energy
DOI10.1116/1.3167372
Indexed BySCI
Language英语
WOS IDWOS:000268535600034
PublisherA V S AMER INST PHYSICS
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Document Type期刊论文
Identifierhttp://ir.iccas.ac.cn/handle/121111/66582
Collection中国科学院化学研究所
Corresponding AuthorWang, Zhe
Affiliation1.Kyushu Univ, Inst Mat Chem & Engn, Nishi Ku, Fukuoka 8190395, Japan
2.Acad Sinica, Changchun Inst Appl Chem, State Key Lab Polymer Phys & Chem, Changchun 130022, Peoples R China
Recommended Citation
GB/T 7714
Wang, Zhe,Yu, Xinhong,Xing, Rubo,et al. Micropatterning of polymeric semiconductor by selective lift-off method using epoxy mold[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,2009,27(4):1958-1962.
APA Wang, Zhe,Yu, Xinhong,Xing, Rubo,Han, Yanchun,&Takahara, Atsushi.(2009).Micropatterning of polymeric semiconductor by selective lift-off method using epoxy mold.JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,27(4),1958-1962.
MLA Wang, Zhe,et al."Micropatterning of polymeric semiconductor by selective lift-off method using epoxy mold".JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B 27.4(2009):1958-1962.
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