ICCAS OpenIR
Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step
Ji, Zhuoyu1,2; Li, Hongxiang1; Liu, Yaling1,2; Hu, Wenping1
2008-05-01
Source PublicationAPPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
ISSN0947-8396
Volume91Issue:2Pages:301-303
AbstractIn this paper we propose a method for the integration of the synthesis of silver-tetracyanoquinodimethane (AgTCNQ) and the fabrication of its devices within one step. The method was performed by electroplating Ag between gold coplanar micro-gap electrodes in tetracyanoquinodimethane (TCNQ) solution. As soon as silver was electrochemically dissolved in the TCNQ solution, it immediately reacted with TCNQ to form AgTCNQ and then deposited between Au gap electrodes. With the continuing of the reaction, the Au micro-gap electrodes were connected by AgTCNQ to form Au/AgTCNQ/Au coplanar gap devices. With this electroplating technique, series gap devices of AgTCNQ were fabricated, and the devices exhibited switching phenomena with good reproducibility. This method integrated the synthesis of AgTCNQ and the fabrication of its devices within a single step, and should be also inspirable for other charge transfer complexes.
DOI10.1007/s00339-008-4399-0
Indexed BySCI
Language英语
WOS IDWOS:000254086700017
PublisherSPRINGER
Citation statistics
Cited Times:6[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.iccas.ac.cn/handle/121111/65528
Collection中国科学院化学研究所
Corresponding AuthorHu, Wenping
Affiliation1.Chinese Acad Sci, Inst Chem, Beijing Normal Lab Mol Sci, Key Lab Organ Solids, Beijing 100080, Peoples R China
2.Chinese Acad Sci, Grad Sch, Beijing 100039, Peoples R China
Recommended Citation
GB/T 7714
Ji, Zhuoyu,Li, Hongxiang,Liu, Yaling,et al. Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step[J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2008,91(2):301-303.
APA Ji, Zhuoyu,Li, Hongxiang,Liu, Yaling,&Hu, Wenping.(2008).Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step.APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,91(2),301-303.
MLA Ji, Zhuoyu,et al."Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step".APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING 91.2(2008):301-303.
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