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Propargyl silicon-cyclopentadiene oligomeric resin with high temperature resistance
Wang, Mingcun; Yang, Ming; Zhao, Tong
2008-12-01
Source PublicationPOLYMERS FOR ADVANCED TECHNOLOGIES
ISSN1042-7147
Volume19Issue:12Pages:1822-1827
AbstractMultiple propargyl substituted cyclopentadiene was synthesized by phase transfer reaction between cyclopentadiene and propargyl bromide in an aqueous solution mediated by sodium hydroxide. It was found that propargylated cyclopentadiene (PCp) could be thermally cured with a mass loss of ca 28%, while the cured material showed a high char yield of ca 76% at 900 degrees C. In order to overcome the processing problems of PCp, a condensation reaction between PCp di-anion and dimethyldichlorosilane was performed to make a silicon-PCp (SiPCp) oligomeric resin. SiPCp resin has an acceptable processability, attributed to its organosolubility, low viscosity, and broad processing window. SiPCp resin can readily undergo thermal cure via addition polymerization of ethynyl groups in the temperature range of 170-270 degrees C with an exothermic maximum at ca 240 degrees C, and the mass loss upon cure was less than 5%. Evidenced by the results of dynamic mechanical analysis (DMA) and thermogravimetric analysis (TGA) in a nitrogen atmosphere, the cured SiPCp resin exhibited stable thermo-mechanical properties up to 320 degrees C, and possessed an anerobic char yield of ca 77% at 900 degrees C. The results of TGA in air atmosphere revealed the higher oxidation resistance of SiPCp resin. Copyright (C) 2008 John Wiley & Sons, Ltd.
KeywordPropargyl Cyclopetadiene Silicon Thermal Cure Thermal Properties
DOI10.1002/pat.1206
Indexed BySCI
Language英语
WOS IDWOS:000262034100018
PublisherJOHN WILEY & SONS LTD
Citation statistics
Cited Times:4[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.iccas.ac.cn/handle/121111/64970
Collection中国科学院化学研究所
Corresponding AuthorWang, Mingcun
AffiliationChinese Acad Sci, Inst Chem, High Performance Polymers Lab, Beijing 100080, Peoples R China
Recommended Citation
GB/T 7714
Wang, Mingcun,Yang, Ming,Zhao, Tong. Propargyl silicon-cyclopentadiene oligomeric resin with high temperature resistance[J]. POLYMERS FOR ADVANCED TECHNOLOGIES,2008,19(12):1822-1827.
APA Wang, Mingcun,Yang, Ming,&Zhao, Tong.(2008).Propargyl silicon-cyclopentadiene oligomeric resin with high temperature resistance.POLYMERS FOR ADVANCED TECHNOLOGIES,19(12),1822-1827.
MLA Wang, Mingcun,et al."Propargyl silicon-cyclopentadiene oligomeric resin with high temperature resistance".POLYMERS FOR ADVANCED TECHNOLOGIES 19.12(2008):1822-1827.
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